産品特(tè)點(diǎn)
産品功能
産品簡介：
Product introduction:
Leetop_LHR-D5241F2是一(yī)款基于(yú)Leetop_B100载(zài)闆設計(jì)的(de) 主(zhǔ)動(dòng)散(sàn)热(rè)機(jī)型，內(nèi)置強(qiáng)大(dà)的(de)RDK X3模組，且(qiě)提(tí)供5Tops的(de)算力。 搭载(zài)4核ARM Cortex®A53處(chù)理(lǐ)器，为(wèi)用(yòng)戶提(tí)供強(qiáng)大(dà)的(de)計(jì)算性(xìng)能。 此(cǐ)外(wài)，Leetop_LHR-D5241F2還(huán)配備了(le)4个(gè)USB 3.0接口(kǒu)和(hé)2个(gè)USB 2.0接口(kǒu)，提(tí)供多(duō)樣(yàng)化(huà)的(de)外(wài)設連(lián)接選项，滿足各(gè)類(lèi)场景的(de)使用(yòng)需求。 同(tóng)时(shí)，支持(chí)HDMI顯示接口(kǒu)，實(shí)現(xiàn)图(tú)形化(huà)桌(zhuō)面(miàn)顯示。整機(jī)還(huán)提(tí)供 主(zhǔ)動(dòng)散(sàn)热(rè)，滿足用(yòng)戶的(de)散(sàn)热(rè)需求。
Leetop_LHR-D5241F is a high-performance machine that adopts the Leetop_B100 carrier board design and is equipped with the powerful RDK X3 module, with an inference computing power of up to 5 Tops. Equipped with an 4-core ARM Cortex® A53 processor, it provides users with excellent computing performance. Supports detachable housing serial port debugging, suitable for various debugging scenarios. In addition, Leetop_LHR-D5241F is equipped with 4 USB 3.0 interfaces and 2 USB 2.0 interfaces, providing a variety of peripheral connection options to meet the needs of various scenarios. At the same time, it also provides active cooling to meet users’ cooling needs.
産品規格 ：
Product specification ：
| Project | Specification |
| Module Compa tibility | RDK X3 Moudle |
| Display | 1x HDMI;1xDSI |
| Etherne | 1x Gigabit Ethernet (10/100/1000) |
| USB | 4x USB 3.0 2x USB 2.0(1xDebug;1xMicro USB |
| Audio | 1x Audio jack |
| Camera | 3x CSI Camera |
| Function port | 1xSPI; 2xGPIO |
| DC | Power interface |
| Input Voltage | 12V(MAX 35W) DC Input |
| Load capacity | Above 35W |
| Structure size | 116x88.7x44.6(mm) |
| Operating Temperature | -20℃-60℃ |
産品規格 Product specification：
處(chù)理(lǐ)器模块(kuài) Processor module：
RDK X3 Moudle 主(zhǔ)要(yào)包含四核Cortex®A53處(chù)理(lǐ)器、5Tops算力、最高(gāo)4GB內(nèi)存且(qiě)支持(chí)4K@60幀視頻編解(jiě)；主(zhǔ)要(yào)接口(kǒu)包括 HDMI、千(qiān)兆(zhào)以(yǐ)太网(wǎng)、USB 3.0、USB2.0、MIPI CSI、UART Debug、TF 卡(kǎ)接口(kǒu)等。
模組搭载(zài)双(shuāng)頻 2.4/5.0GHz 無線(xiàn)局(jú)域网(wǎng)和(hé)藍(lán)牙(yá) 4.2 模块(kuài)，單闆上(shàng)已具備 PCB 天(tiān)線(xiàn)，同(tóng)时(shí)也(yě)可(kě)以(yǐ)搭配外(wài)部(bù)天(tiān)線(xiàn)套(tào)件(jiàn)使用(yòng)，能夠實(shí)現(xiàn)無線(xiàn)連(lián)接，降低(dī)用(yòng)戶開(kāi)發(fà)和(hé) 測試成(chéng)本(běn)，縮短(duǎn)上(shàng)市(shì)时(shí)间。
RDK X3 Module 可(kě)選的(de)闆载(zài) RAM 容量(liàng)包括 2GB、4GB。
RDK X3 Moudle mainly includes a quad-core Cortex® A53 processor, 5Tops computing power, up to 4GB memory and supports 4K@60 frame video encoding and decoding; the main interfaces include HDMI, Gigabit Ethernet, USB 3.0, USB2.0, MIPI CSI, UART Debug, TF card interface, etc.
The module is equipped with dual-band 2.4/5.0GHz wireless LAN and Bluetooth 4.2 modules. The board already has a PCB antenna and can also be used with an external antenna kit to achieve wireless connections, reduce user development and testing costs, and shorten time to market.
The optional onboard RAM capacities of RDK X3 Module include 2GB and 4GB.
尺(chǐ)寸(cùn)示意(yì)图(tú)：
Dimensional diagram：
| 正(zhèng)視图(tú) Front view | 左(zuǒ)視图(tú) Left view |
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| 俯視图(tú) Top view | 後(hòu)視图(tú) Rear view |
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