産品特(tè)點(diǎn)
産品功能
産品簡介：
Product introduction：
Leetop_B100是基于(yú)RDK X3模組設計(jì)的(de)一(yī)款全(quán)功能開(kāi) 發(fà)闆。是一(yī)款其具豐富外(wài)設接口(kǒu)，高(gāo)性(xìng)能的(de)智能载(zài)闆。RDK X3模組搭载(zài)地(dì)平線(xiàn)旭日®3系(xì)列高(gāo)性(xìng)能的(de)智能芯片(piàn)，提(tí)供強(qiáng) 大(dà)的(de)端側通(tòng)用(yòng)与人(rén)工智能算力。
Leetop_B100 is a full-featured development board designed based on the RDK X3 module. It is an intelligent carrier board with rich peripheral interfaces
and high performance.The RDK X3 module is equipped with Horizon Rising Sun® 3 series high- performance smart chips, providing powerful end-side general-purpose and artificial intelligence computing power.
産品規格 ：
Product specification：
| Project | Specification |
| Module Compatibility | RDK X3 Moudle |
| Display | 1x HDMI |
| Ethernet | 1x Gigabit Ethernet (10/100/1000) |
| USB | 4x USB 3.0 2x USB 2.0(1xDebug;1xMicro USB |
| Audio | 2x SPEAKER; 1x Audio jack |
| Camera | 3x CSI Camera(2x2_lane; 1x4_lane) |
| FAN | 1xFAN(5V PWM) |
| RTC CON | 1x3.0V RTC |
| Function con | 11x GPIO; 1x I2C; 1xSPI; 1x SPK_R; 1x SPK_L |
| DC | Power interface |
| Input Voltage | 12V(MAX 35W) DC Input |
| Load capacity | Above 35W |
| Dimensions (W×D ×H) | 100X79 (mm) |
| Operating Temperature | -20℃-60℃ |
Storage Temperature Humidit | -20℃-60℃ 10% -90% Non condensation environment |
| Weight | 0.0587KG |
産品規格 Product specification：
處(chù)理(lǐ)器模块(kuài) Processor module：
RDK X3 Moudle 主(zhǔ)要(yào)包含四核Cortex®A53處(chù)理(lǐ)器、5Tops算力、最高(gāo)4GB內(nèi)存且(qiě)支持(chí)4K@60幀視頻編解(jiě)；主(zhǔ)要(yào)接口(kǒu)包括 HDMI、千(qiān)兆(zhào)以(yǐ)太网(wǎng)、USB 3.0、USB2.0、MIPI CSI、UART Debug、TF 卡(kǎ)接口(kǒu)等。
模組搭载(zài)双(shuāng)頻 2.4/5.0GHz 無線(xiàn)局(jú)域网(wǎng)和(hé)藍(lán)牙(yá) 4.2 模块(kuài)，單闆上(shàng)已具備 PCB 天(tiān)線(xiàn)，同(tóng)时(shí)也(yě)可(kě)以(yǐ)搭配外(wài)部(bù)天(tiān)線(xiàn)套(tào)件(jiàn)使用(yòng)，能夠實(shí)現(xiàn)無線(xiàn)連(lián)接，降低(dī)用(yòng)戶開(kāi)發(fà)和(hé) 測試成(chéng)本(běn)，縮短(duǎn)上(shàng)市(shì)时(shí)间。
RDK X3 Module 可(kě)選的(de)闆载(zài) RAM 容量(liàng)包括 2GB、4GB。
RDK X3 Moudle mainly includes a quad-core Cortex® A53 processor, 5Tops computing power, up to 4GB memory and supports 4K@60 frame video encoding and decoding; the main interfaces include HDMI, Gigabit Ethernet, USB 3.0, USB2.0, MIPI CSI, UART Debug, TF card interface, etc.
The module is equipped with dual-band 2.4/5.0GHz wireless LAN and Bluetooth 4.2 modules. The board already has a PCB antenna and can also be used with an external antenna kit to achieve wireless connections, reduce user development and testing costs, and shorten time to market.
The optional onboard RAM capacities of RDK X3 Module include 2GB and 4GB.
産品外(wài)观：
Product appearance：
| 正(zhèng)面(miàn) Front interface | 背面(miàn) Back interface |
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