産品特(tè)點(diǎn)
産品功能(néng)
産品簡介：
Product introduction:
Leetop_SUBKIT_610_Orin_Nano是(shì)基于(yú)英伟达(dá)Orin Nano核心板研發(fà)的(de)一(yī)款 嵌入(rù)式人(rén)工智能(néng)计算机，能(néng)夠为衆多(duō)終(zhōng)端設備賦予高(gāo)达(dá)20/40TOPS的(de)计算力。 Jetson Orin Nano可(kě)以和(hé)NVIDIA強(qiáng)大(dà)的(de)AI软(ruǎn)件(jiàn)堆(duī)栈/SDK及(jí)软(ruǎn)件(jiàn)平台(tái)相結合，作(zuò) 为高(gāo)性(xìng)能(néng)低(dī)功耗的(de)嵌入(rù)式邊(biān)緣计算設備，主(zhǔ)要(yào)應(yìng)用(yòng)于(yú)制造、物(wù)流、零(líng)售、服(fú)務(wù)、 农業、智慧城(chéng)市(shì)、醫疗保健、生(shēng)命科學(xué)等領域的(de)先(xiān)進(jìn)人(rén)工智能(néng)机器人(rén)、邊(biān)緣檢測 設備和(hé)AI應(yìng)用(yòng)场(chǎng)景。 Leetop_SUBKIT_610_Orin_Nano提(tí)供快(kuài)速的(de)主(zhǔ)动散(sàn)热(rè)設计 ，可(kě)以滿足抗震防静(jìng)電(diàn)等工業标(biāo)準。同(tóng)时(shí) Leetop_SUBKIT_610_Orin_Nano 接口 豐富性(xìng)價比高(gāo)。
Leetop_SUBKIT_610_Orin_Nano an embedded artificial intelligence computer developed based on NVIDIA's Orin Nano core module, which can give up to 20/40TOPS computing power to many terminal devices. Jetson Orin Nano can be combined with NVIDIA's powerful AI software stack/SDK and software platform as a high-performance and low-power embedded edge computing device, mainly used in manufacturing, logistics, retail, services, agriculture, smart city, healthcare, life sciences and other fields of advanced artificial intelligence robots, edge detection equipment and AI application scenarios. Leetop_SUBKIT_610_Orin_Nano provides a fast active heat dissipation design that can meet industry standards such as anti-vibration and anti-static. meantime
Leetop_SUBKIT_610_Orin_Nano interfaces are abundant and cost-effective.
産品規格 Product specification：
處(chù)理(lǐ)器模块(kuài) Processor module：
| Jetson Orin Nano 4GB | Jetson Orin Nano 8GB | |
AI Performance | 20 TOPS | 40 TOPS |
| GPU | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
| CPU | 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | |
| Video Encode | 1080p30 supported by 1-2 CPU cores | |
| Video Decode | 1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265) | |
| Memory | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s |
| Storage | — (Supports external NVMe) | |
| Project | Spec |
| Input Voltage | +10---+24V(60W) DCInput |
| Load capacity | Above60W |
| Dimensions (W×D ×H) | 104.9x100.08x33.05 (mm) |
| Operating Temperature | -25℃-70℃ |
Storage Temperature /Humidity | -25℃-65℃ 10%-90% Non Condensing Environment |
| Weight | 0.18615KG |
| Interface | Specification |
| Network | 1x Gigabit Ethernet (10/100/1000) |
| USB | 4x USB 3.0 Type A (Integrated USB 2.0) 3X USB(CONNECT) 1x USB2.0 (TYPE C) |
| Video output | 2× HDMI |
| Function key | 1x Power key; 1xRecovery key ; 1xReset key |
尺(chǐ)寸示意(yì)图(tú) ：
Schematic diagram of dimensions：
| 正(zhèng)视图(tú) Front view | 左(zuǒ)视图(tú) Left view |
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| 俯视图(tú) Up view | 底部(bù)图(tú) Bottom view |
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