Product features
Product function
産品簡介：
Product introduction：
Leetop_B100是(shì)基于(yú)RDK X3模组設计的(de)一(yī)款全(quán)功能(néng)開(kāi) 發(fà)板。是(shì)一(yī)款其(qí)具豐富外(wài)設接口，高(gāo)性(xìng)能(néng)的(de)智能(néng)载(zài)板。RDK X3模组搭载(zài)地(dì)平線(xiàn)旭日(rì)®3系(xì)列高(gāo)性(xìng)能(néng)的(de)智能(néng)芯片，提(tí)供強(qiáng) 大(dà)的(de)端側通(tòng)用(yòng)與(yǔ)人(rén)工智能(néng)算力。
Leetop_B100 is a full-featured development board designed based on the RDK X3 module. It is an intelligent carrier board with rich peripheral interfaces
and high performance.The RDK X3 module is equipped with Horizon Rising Sun® 3 series high- performance smart chips, providing powerful end-side general-purpose and artificial intelligence computing power.
産品規格 ：
Product specification：
| Project | Specification |
| Module Compatibility | RDK X3 Moudle |
| Display | 1x HDMI |
| Ethernet | 1x Gigabit Ethernet (10/100/1000) |
| USB | 4x USB 3.0 2x USB 2.0(1xDebug;1xMicro USB |
| Audio | 2x SPEAKER; 1x Audio jack |
| Camera | 3x CSI Camera(2x2_lane; 1x4_lane) |
| FAN | 1xFAN(5V PWM) |
| RTC CON | 1x3.0V RTC |
| Function con | 11x GPIO; 1x I2C; 1xSPI; 1x SPK_R; 1x SPK_L |
| DC | Power interface |
| Input Voltage | 12V(MAX 35W) DC Input |
| Load capacity | Above 35W |
| Dimensions (W×D ×H) | 100X79 (mm) |
| Operating Temperature | -20℃-60℃ |
Storage Temperature Humidit | -20℃-60℃ 10% -90% Non condensation environment |
| Weight | 0.0587KG |
産品規格 Product specification：
處(chù)理(lǐ)器模块(kuài) Processor module：
RDK X3 Moudle 主(zhǔ)要(yào)包(bāo)含四核Cortex®A53處(chù)理(lǐ)器、5Tops算力、最(zuì)高(gāo)4GB內(nèi)存且(qiě)支持(chí)4K@60幀视頻編解(jiě)；主(zhǔ)要(yào)接口包(bāo)括 HDMI、千(qiān)兆(zhào)以太网(wǎng)、USB 3.0、USB2.0、MIPI CSI、UART Debug、TF 卡接口等。
模组搭载(zài)双(shuāng)頻 2.4/5.0GHz 無線(xiàn)局(jú)域网(wǎng)和(hé)藍(lán)牙(yá) 4.2 模块(kuài)，單板上(shàng)已具備 PCB 天(tiān)線(xiàn)，同(tóng)时(shí)也(yě)可(kě)以搭配外(wài)部(bù)天(tiān)線(xiàn)套(tào)件(jiàn)使用(yòng)，能(néng)夠實(shí)現(xiàn)無線(xiàn)連(lián)接，降低(dī)用(yòng)戶開(kāi)發(fà)和(hé) 測試成(chéng)本(běn)，縮短(duǎn)上(shàng)市(shì)时(shí)間(jiān)。
RDK X3 Module 可(kě)選的(de)板载(zài) RAM 容量(liàng)包(bāo)括 2GB、4GB。
RDK X3 Moudle mainly includes a quad-core Cortex® A53 processor, 5Tops computing power, up to 4GB memory and supports 4K@60 frame video encoding and decoding; the main interfaces include HDMI, Gigabit Ethernet, USB 3.0, USB2.0, MIPI CSI, UART Debug, TF card interface, etc.
The module is equipped with dual-band 2.4/5.0GHz wireless LAN and Bluetooth 4.2 modules. The board already has a PCB antenna and can also be used with an external antenna kit to achieve wireless connections, reduce user development and testing costs, and shorten time to market.
The optional onboard RAM capacities of RDK X3 Module include 2GB and 4GB.
産品外(wài)觀：
Product appearance：
| 正(zhèng)面(miàn) Front interface | 背面(miàn) Back interface |
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