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Product features

Product function

産品簡介:

Product introduction:


Leetop_ALP_608_F是基于(yú)英伟达(dá)Orin NANO/Orin NX 核心(xīn)闆研發(fà)的(de)一(yī) 款嵌入式人(rén)工智能計(jì)算機(jī), 能夠为(wèi)衆多(duō)終(zhōng)端設備賦予高(gāo)达(dá)20/40/70/ 100TOPS的(de)計(jì)算力。 Jetson Orin NANO/Orin NX 可(kě)以(yǐ)和(hé)NVIDIA強(qiáng)大(dà)的(de)AI 软(ruǎn)件(jiàn)堆(duī)棧/SDK 及(jí)软(ruǎn)件(jiàn)平台(tái)相結合,作(zuò)为(wèi)高(gāo)性(xìng)能低(dī)功耗的(de)嵌入式邊(biān)緣計(jì)算設備 ,主(zhǔ)要(yào)應(yìng)用(yòng)于(yú)制造、物(wù)流、零(líng)售、服(fú)務(wù)、農業、智慧城(chéng)市(shì)、醫療保健、生(shēng)命 科學(xué)等領域的(de)先(xiān)進(jìn)人(rén)工智能機(jī)器人(rén)、邊(biān)緣檢測設備和(hé)A I應(yìng)用(yòng)场景. Leetop_ ALP_608_F提(tí)供快(kuài)速的(de)主(zhǔ)動(dòng)散(sàn)热(rè)設計(jì), 可(kě)以(yǐ)滿足抗震防静(jìng)電(diàn)等工業标(biāo)準。 同(tóng) 时(shí)Leetop_ALP_608_F接口(kǒu)豐富性(xìng)價比高(gāo)。


Leetop_ ALP_ 608_ F is an embedded artificial intelligence computer  developed based on the NVIDIA Orin NANO/Orin NX core module, which can provide up to 20/40/70/100 TOPS of computing power to numerous terminal devices. Jetson Orin NANO/Orin NX can be combined with NVIDIA's powerful AI software stack/SDK and software platform. As a high-performance and low-power embedded edge computing device, it is mainly used in advanced artificial intelligence robots, edge detection devices and AI application scenarios in manufacturing, logistics, retail, service, agriculture, smart city, health care, life science and other fields Leetop_ ALP_ 608_ F provides a fast active heat dissipation design that can meet industrial standards such as earthquake resistance and anti-static. Meanwhile, Leetop_ ALP_ 608_ F interface is rich and cost-effective.


産品規格 Product specification: 

處(chù)理(lǐ)器模块(kuài) Processor module:


Jetson Orin NX 8GBJetson Orin NX 16GB
AI Performance70 TOPS100 TOPS
GPU

1024-core NVIDIA Ampere GPU

with 32 Tensor Cores

CPU

6-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 1.5MB

L2 + 4MB L3

8-core NVIDIA Arm ® Cortex A78AE v8.2 64-bit CPU 2MB L2

+ 4MB L3

Video Encode1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x

1080p30 (H.264)

Video Decode1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30

(H.264)

Memory8 GB 128-bit LPDDR5 102.4 GB/s16 GB 128-bit LPDDR5 102.4 GB/s
Storage

(Supports external NVMe)



Jetson Orin Nano 4GBJetson Orin Nano 8GB
AI Performance20TOPS40TOPS
GPU

512-core NVIDIA Ampere architecture GPU with 16 Tensor

Cores

1024-core NVIDIA Ampere architecture GPU with

32 Tensor Cores

CPU6-core Arm® Cortex®-A78AE v8.2 64-bit

CPU 1.5MB L2 + 4MB L3

Video Encode1080p30 supported by

1-2 CPU cores

Video Decode1x 4K60 (H.265) 2x4K30 (H.265)

5x1080p60 (H.265) 11x1080p30 (H.265)

Memory4GB 64-bit LPDDR5 34 GB/s8GB 128-bit LPDDR5 68 GB/s
Storage

(Supports external NVMe)


産品規格 :

Product specification:

Feature
Specification
Display1x DP
Ethernet2x Gigabit Ethernet (10/100/1000)
USB

4x USB 3.2 Type A (Integrated USB 2.0)

1x USB 2.0+3.2 Type C

Camera2xCSI Camera
FAN1xFAN(5V PWM)
RTC CON1x 3.0V RTC
CAN1xCAN (FD)
Audio

1x3.5 Audio Jack;

2X MIC;

2X SPEAKER;

1X SPEAKER FEEDBACK

Function CON

2X IIC; 1X SPI;

7X IO 3.3V; 2x UART; 1X DEBUG; 1X POWER; 1X RESET;

1X RECOVERY

DCPower interface


産品規格

Product specification:

ProjectSpec
Input Voltage+9-- +20V(MAX 60W) DC Input
Load capacityAbove 60W
Dimensions (W×D ×H)126x107x39.5(mm)
Operating Temperature-25℃-65℃

Storage Temperature

Humidity

-25℃-65℃ 10% -90%

non condensation environment

Weight0.6546KG


尺(chǐ)寸(cùn)示意(yì)图(tú):

Schematic diagram of dimensions:

正(zhèng)視图(tú)  Front  view左(zuǒ)視图(tú)  Left  view
image.pngimage.png
俯視图(tú)  Up  view後(hòu) 視 图(tú)  Rear    view
image.pngimage.png


Online consultation

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