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Product features

Product function

産品簡介

Product introduction


Leetop ALP_606F是(shì)基于(yú)英伟达(dá)Orin Nano/Orin Nx核心板研發(fà)的(de)-款嵌入(rù)式人(rén)工智能(néng)计算机,能(néng)夠为衆多(duō)終(zhōng)端設備賦予高(gāo)达(dá)20/40/70/100TOPS的(de)计算力。Leetop ALP_606 F提(tí)供快(kuài)速的(de)主(zhǔ)动散(sàn)热(rè)設计,可(kě)以滿足抗震防静(jìng)電(diàn)等工業标(biāo)準。同(tóng)时(shí)Leetop ALP 606 F接口豐富性(xìng)價比高(gāo)。


Leetop ALP606 F is an embedded artificial intelligence computerbased on NVIDIA Orin Nano/Orin Nx module,which can provide up to20/40/70/100TOPS computing power to many terminal devices.Leetop ALP_606 F provides active thermal design for fast,which canmeet industrial standards such as seismic and anti-static. At the sametime ,Leetop ALP 606 F interface rich, high cost performance


産品規格 Product specification

處(chù)理(lǐ)器模块(kuài) Processor module


Jetson Orin Nano 4GBJetson Orin Nano 8GB
AI Performance20 TOPS40 TOPS
GPU512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores
CPU6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3
Video Encode1080p30 supported by 1-2 CPU cores
Video Decode1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265)
Memory4GB 64-bit LPDDR5 34 GB/s8GB 128-bit LPDDR5 68 GB/s
Storage

— 

(Supports external NVMe)



Jetson Orin NX 8GBNX 8GB Jetson Orin NX 16GB
AI Performance70 TOPS100 TOPS
GPU1024-core NVIDIA Ampere GPU with 32 Tensor Cores
CPU6-core NVIDIA Arm® Cortex A78AE v8.2 64- bit CPU 1.5MB L2 + 4MB L38-core NVIDIA Arm® Cortex A78AE v8.2 64- bit CPU 2MB L2 + 4MB L3
Video Encode1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264)
Video Decode1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264)
Memory8 GB 128-bit LPDDR5 102.4 GB/s102.4 GB/s 16 GB 128-bit LPDDR5 102.4 GB/s
Storage

(Supports external NVMe)


接口I/O

接 口 Interface規格 Specification
Network1 × Gigabit Ethernet Connector (10/100/1000)
USB4x USB 3.0 Type A (Integrated USB 2.0) 1x  USB 2.0 +3.0Type C
Video output1 × HDMI
CAN1 × CAN 1CAN(Receive. Transceiver)
SPI Bus1 × SPI Bus(+3.3V Level)
Power+9--+20V (60W)


供電(diàn) Power Supply

Power SupplySpec
Input Voltage+9--+20V (60W)
Power consumption60W


結構 Mechanical

MechanicalSpec
Dimensions (W×D ×H)116x87x43(mm)
Weight531g


环(huán)境Environmental

EnvironmentalSpec
Operating Temperature-25℃-75℃
Storage Humidity10%-90% non-condensing 非(fēi)結露(lù)环(huán)境


尺(chǐ)寸示意(yì)图(tú)Schematic diagram of dimensions

正(zhèng)视图(tú) Front view左(zuǒ)视图(tú) Left view
image.pngimage.png
俯视图(tú) Up view底部(bù)图(tú) Bottom view
image.pngimage.png


選配表(biǎo)Matching table

Product nameCore moduleSSDcommunicationpower
ALP-606-F




J1:Orin Nano(4G)



J2:Orin Nano(8G)



J3:Orin NX(8G)



J4:Orin NX(16G)




N



128G



256G



512G



1T




N




N




01:明(míng)緯




02:定(dìng)制


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